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Summary:¹ The top cited patents in semiconductors, as indicated by the citations received from other patents granted in 2022, reveal several key trends in semiconductor technology:
Advanced Transistor Technologies: The development of advanced transistor technologies, such as FinFETs and 3D transistors, is a major focus. These technologies enable smaller, faster, and more energy-efficient devices.
3D Chip Stacking: Patents related to 3D chip stacking highlight the increasing need for higher integration density and improved performance. By stacking multiple layers of chips, manufacturers can create more powerful and complex systems.
Advanced Packaging Technologies: Patents covering advanced packaging technologies, such as package-on-package (PoP) and fan-out packaging, are also prominent. These technologies enable the integration of multiple chips and components into a single package, reducing the overall size and improving performance.
Material Science and Process Innovations: Patents related to materials science and process innovations, such as the development of new materials for gate dielectrics and interconnects, are crucial for driving semiconductor technology forward.
Overall, the top cited patents in semiconductors reflect the ongoing pursuit of miniaturization, higher performance, and lower power consumption. These advancements are essential for enabling the continued growth of the semiconductor industry and powering the digital revolution.
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